3D electro-thermal investigations for reliability of ultra low ON state resistance power MOSFET. - Jean-Baptiste Sauveplane; Patrick Tounsi; Emmanuel Scheid; A. Deram (Microelectron. Reliab., 2008)

On the accurate determination of the thermomechanical properties of micro-scale material: Application to AlSi1% chip metallization of a power semiconductor device. - Jean-Baptiste Sauveplane; Emmanuel Scheid; A. Deram (Microelectron. Reliab., 2009)

A reliable solderless connection technique for high I/O counts ceramic land grid array package for space applications. - Jean-Baptiste Sauveplane; Patrice Retho; Norbert Venet; David Buso; Guy Perez; Jean-Sébastien Lefrileux (Microelectron. Reliab., 2015)