3D integration technology for set-top box application. - David Henry; Séverine Cheramy; Jean Charbonnier; Pascal Chausse; Muriel Neyret; Cathy Brunet-Manquat; Sophie Verrun; Nicolas Sillon; Laurent Bonnot; Xavier Gagnard; E. Saugier (3DIC, 2009)

An efficient and simple compact modeling approach for 3-D interconnects with IC's stack global electrical context consideration. - Jean-Etienne Lorival; Françis Calmon; Fengyuan Sun; Felipe Frantz; Carole Plossu; Martine Le Berre; Ian O'Connor; Olivier Valorge; Jean Charbonnier; David Henry; Christian Gontrand (Microelectron. J., 2015)

Using Word Embeddings for Unsupervised Acronym Disambiguation. - Jean Charbonnier; Christian Wartena (COLING, 2018)

Text-Based Annotation of Scientific Images Using Wikimedia Categories. - Frieda Josi; Christian Wartena; Jean Charbonnier (DEXA Workshops, 2018)

NOA: A Search Engine for Reusable Scientific Images Beyond the Life Sciences. - Jean Charbonnier; Lucia Sohmen; John Rothman; Birte Rohden; Christian Wartena (ECIR, 2018)

Figures in Scientific Open Access Publications. - Lucia Sohmen; Jean Charbonnier; Ina Blümel; Christian Wartena; Lambert Heller (TPDL, 2018)

Predicting Word Concreteness and Imagery. - Jean Charbonnier; Christian Wartena (IWCS (1), 2019)

POPSTAR: a Robust Modular Optical NoC Architecture for Chiplet-based 3D Integrated Systems. - Yvain Thonnart; Stéphane Bernabé; Jean Charbonnier; Christian Bernard; David Coriat; César Fuguet Tortolero; Pierre Tissier; Benoît Charbonnier; Stéphane Malhouitre; Damien Saint-Patrice; Myriam Assous; Aditya Narayan; et al. (DATE, 2020)

2.3 A 220GOPS 96-Core Processor with 6 Chiplets 3D-Stacked on an Active Interposer Offering 0.6ns/mm Latency, 3Tb/s/mm2 Inter-Chiplet Interconnects and 156mW/mm2@ 82%-Peak-Efficiency DC-DC Converters. - Pascal Vivet; Eric Guthmuller; Yvain Thonnart; Gaël Pillonnet; Guillaume Moritz; Ivan Miro-Panades; César Fuguet Tortolero; Jean Durupt; Christian Bernard; Didier Varreau; Julian J. H. Pontes; Sébastien Thuries; et al. (ISSCC, 2020)

Predicting the Concreteness of German Words. - Jean Charbonnier; Christian Wartena (SwissText/KONVENS, 2020)

IntAct: A 96-Core Processor With Six Chiplets 3D-Stacked on an Active Interposer With Distributed Interconnects and Integrated Power Management. - Pascal Vivet; Eric Guthmuller; Yvain Thonnart; Gaël Pillonnet; César Fuguet Tortolero; Ivan Miro-Panades; Guillaume Moritz; Jean Durupt; Christian Bernard; Didier Varreau; Julian J. H. Pontes; Sébastien Thuries; et al. (IEEE J. Solid State Circuits, 2021)

Predicting Visible Terms from Image Captions using Concreteness and Distributional Semantics. - Jean Charbonnier; Christian Wartena (KDIR, 2022)

Specificities of linear Si QD arrays integration and characterization. - Heimanu Niebojewski; Benoit Bertrand; Etienne Nowak; Thomas Bedecarrats; Bruna Cardoso Paz; Lauriane Contamin; Pierre-André Mortemousque; V. Labracherie; L. Brevard; H. Sahin; Jean Charbonnier; C. Thomas; et al. (VLSI Technology and Circuits, 2022)

A Cryogenic Active Router for Qubit Array Biasing from DC to 320 MHz at 100 nm Gate Pitch. - Baptiste Jadot; Marcos Zurita; Gérard Billiot; Yvain Thonnart; Loïck Le Guevel; Mathieu Darnas; Candice Thomas; Jean Charbonnier; Tristan Meunier; Maud Vinet; Franck Badets; Gaël Pillonnet (ESSCIRC, 2023)