New experimental approach for failure prediction in electronics: Topography and deformation measurement complemented with acoustic microscopy. - Isaline Richard; Romain Fayolle; Jean-Claude Lecomte (Microelectron. Reliab., 2005)

An advanced quality and reliability assessment approach applied to thermal stress issues in electronic components and assemblies. - Michael Hertl; Diane Weidmann; Jean-Claude Lecomte (Microelectron. Reliab., 2009)