CMP monitoring and prediction based metal fill. - Philippe Morey-Chaisemartin; Eric Beisser; Jean-Claude Marin; Lidwine Chaize; Pascal Guyader; Julien Rosa (ISQED, 2011)

Device and electromagnetic co-simulation of TSV: Substrate noise study and compact modeling of a TSV in a matrix. - Patrick Le Maitre; Melanie Brocard; Alexis Farcy; Jean-Claude Marin (ISQED, 2012)