3D integration demonstration of a wireless product with design partitioning. - G. Druais; Pascal Ancey; C. Aumont; V. Caubet; Laurent-Luc Chapelon; C. Chaton; Séverine Cheramy; S. Cordova; E. Cirot; Jean-Philippe Colonna; Perceval Coudrain; T. Divel; et al. (3DIC, 2011)

Thermal correlation between measurements and FEM simulations in 3D ICs. - Papa Momar Souare; François de Crecy; Vincent Fiori; M. Haykel Ben Jamaa; Alexis Farcy; Sébastien Gallois-Garreignot; Andras Borbely; Jean-Philippe Colonna; Perceval Coudrain; B. Giraud; C. Laviron; Séverine Cheramy; et al. (3DIC, 2013)

ITAC: A complete 3D integration test platform. - Didier Lattard; Lucile Arnaud; Arnaud Garnier; Nicolas Bresson; Franck Bana; R. Segaud; Amadine Jouve; H. Jacquinot; Stéphane Moreau; Karim Azizi-Mourier; C. Chantre; Pascal Vivet; et al. (3DIC, 2016)

8.1 A 4×4×2 homogeneous scalable 3D network-on-chip circuit with 326MFlit/s 0.66pJ/b robust and fault-tolerant asynchronous 3D links. - Pascal Vivet; Yvain Thonnart; Romain Lemaire; Edith Beigné; Christian Bernard; Florian Darve; Didier Lattard; Ivan Miro Panades; Cristiano Santos; Fabien Clermidy; Séverine Cheramy; Frédéric Pétrot; et al. (ISSCC, 2016)

A 4 × 4 × 2 Homogeneous Scalable 3D Network-on-Chip Circuit With 326 MFlit/s 0.66 pJ/b Robust and Fault Tolerant Asynchronous 3D Links. - Pascal Vivet; Yvain Thonnart; Romain Lemaire; Cristiano Santos; Edith Beigné; Christian Bernard; Florian Darve; Didier Lattard; Ivan Miro Panades; Denis Dutoit; Fabien Clermidy; Séverine Cheramy; et al. (IEEE J. Solid State Circuits, 2017)

Challenges and capabilities of 3D integration in CMOS imaging sensors. - Dominique Thomas; Jean Michailos; Krysten Rochereau (ESSDERC, 2019)