Modeling Thermal Laser Stimulation. - Felix Beaudoin; X. Chauffleur; Jean-Pierre Fradin; Philippe Perdu; Romain Desplats; Dean Lewis (Microelectron. Reliab., 2001)

Innovative Methodology for Predictive Reliability of Intelligent Power Devices Using Extreme Electro-thermal Fatigue. - B. Khong; Patrick Tounsi; Philippe Dupuy; X. Chauffleur; Marc Legros; A. Deram; Colette Levade; G. Vanderschaeve; Jean-Marie Dorkel; Jean-Pierre Fradin (Microelectron. Reliab., 2005)

Virtual reliability assessment of integrated power switches based on multi-domain simulation approach. - Pierre Solomalala; J. Saiz; Michel Mermet-Guyennet; Alberto Castellazzi; Mauro Ciappa; X. Chauffleur; Jean-Pierre Fradin (Microelectron. Reliab., 2007)

Using Compact Thermal Modelling for the Investigation of a Cooling System Dysfunction Applied to a Power Module with Double Sided Cooling. - Anaïs Cassou; Patrick Tounsi; Jean-Pierre Fradin (MIXDES, 2019)

Development of SiC MOSFET Electrical Model and Experimental Validation: Improvement and Reduction of Parameter Number. - Quang Chuc Nguyen; Patrick Tounsi; Jean-Pierre Fradin; Jean-Michel Reynes (MIXDES, 2019)