Conception of optical integrated circuits on polymers. - Bruno Bêche; N. Pelletier; Etienne Gaviot; R. Hierle; Antoine Goullet; Jean-Pierre Landesman; J. Zyss (Microelectron. J., 2006)

Sequential environmental stresses tests qualification for automotive components. - Manoubi Auguste Bahi; Pascal Lecuyer; Hélène Frémont; Jean-Pierre Landesman (Microelectron. Reliab., 2007)

A new methodology for the identification of ball bond degradation during high-temperature aging tests on devices in standard plastic packages. - Manoubi Auguste Bahi; Hélène Frémont; Jean-Pierre Landesman; Annabelle Gentil; Pascal Lecuyer (Microelectron. Reliab., 2009)

Wearout estimation using the Robustness Validation methodology for components in 150 degreeC ambient automotive applications. - Pascal Lecuyer; Hélène Frémont; Jean-Pierre Landesman; Manoubi Auguste Bahi (Microelectron. Reliab., 2010)

Evidence of chlorine ion penetration in InP/InAsP quantum well structures during dry etching processes and effects of induced-defects on the electronic and structural behaviour. - Jean-Pierre Landesman; Christophe Levallois; Juan Jiménez; Frédéric Pommereau; Yoan Léger; Alexandre Beck; Thomas Delhaye; Alfredo Torres; Cesare Frigeri; Ahmed Rhallabi (Microelectron. Reliab., 2015)