Copper interconnect technology for the 32 nm node and beyond. - Jeff Gambino; Fen Chen; John He (CICC, 2009)

Device reliability for CMOS image sensors with backside through-silicon vias. - Jeff Peter Gambino; H. Soleimani; I. Rahim; B. Riebeek; L. Sheng; G. Hosey; H. Truong; Gavin D. R. Hall; R. Jerome; D. Price (IRPS, 2018)

Reliability of an Al2O3/SiO2MIM Capacitor for 180nm (3.3V) Technology. - Jeff Gambino; Derryl D. J. Allman; Gavin D. R. Hall; D. Price; L. Sheng; R. Takada; Y. Kanuma (IRPS, 2019)

BEOL Process Development Using Fast Power Cycling on Test Structures. - Matt Ring; Johan De Greve; Bill Cowell; Darren Moore; Jeff Gambino (IRPS, 2019)