Top-down delayering to expose large inspection area on die side-edge with Platinum (Pt) deposition technique. - Huei Hao Yap; Pik Kee Tan; G. R. Low; M. K. Dawood; Hua Feng; Yuzhe Zhao; Ran He; Hao Tan; J. Zhu; Binghai Liu; Y. M. Huang; D. D. Wang; et al. (Microelectron. Reliab., 2015)

Electrical analysis on implantation-related defect by nanoprobing methodology. - Changqing Chen; P. T. Ng; Ghinboon Ang; H. Tan; Francis Rivai; Y. Z. Ma; Huipeng Ng; Jeffrey Lam; Zhihong Mai (Microelectron. Reliab., 2016)

Cross-sectional nanoprobing fault isolation technique on submicron devices. - Pik Kee Tan; Huei Hao Yap; Changqing Chen; Francis Rivai; Yuzhe Zhao; Lei Zhu; Hua Feng; Hao Tan; Ran He; D. D. Wang; Y. M. Huang; Yin Zhe Ma; et al. (Microelectron. Reliab., 2016)

Application of laser deprocessing technique in PFA on chemical over-etched on bond-pad issue. - Huei Hao Yap; Pik Kee Tan; Lei Zhu; H. Feng; Yuzhe Zhao; Ran He; Hao Tan; B. Liu; Y. M. Huang; D. D. Wang; Jeffrey Lam; Zhihong Mai (Microelectron. Reliab., 2016)

Application of Fast Laser Deprocessing Techniques on large cross-sectional view area sample with FIB-SEM dual beam system. - Yuzhe Zhao; Q. J. Wang; Pik Kee Tan; Huei Hao Yap; Binghai Liu; H. Feng; Hao Tan; Ran He; Y. M. Huang; D. D. Wang; Lei Zhu; C. Q. Chen; et al. (Microelectron. Reliab., 2016)

Concurrent built-in self-testing under the constraint of shared test resources and its test time reduction. - Szu Huat Goh; Y. H. Chan; Zhao Lin; Jeffrey Lam (Integr., 2017)

In-depth circuits edit analysis to reveal the implantation-related defect. - Changqing Chen; Ghim Boon Ang; Jeffrey Lam; Zhihong Mai (Microelectron. J., 2017)

Failure analysis methodology on donut pattern failure due to photovoltaic electrochemical effect. - Soh Ping Neo; Alfred C. T. Quah; Ghim Boon Ang; Dayanand Nagalingam; Hnin Hnin Ma; Siong Luong Ting; C. W. Soo; Changqing Chen; Zhihong Mai; Jeffrey Lam (Microelectron. Reliab., 2017)

Static fault localization of subtle metallization defects using near infrared photon emission microscopy. - Alfred C. T. Quah; Dayanand Nagalingam; Seung Je Moon; Edy Susanto; Ghim Boon Ang; Soh Ping Neo; Jeffrey Lam; Zhihong Mai (Microelectron. Reliab., 2017)

Solving 28 nm I/O circuit reliability issue due to IC design weakness. - Yi Chao Low; Pik Kee Tan; Soon Leng Tan; Yuzhe Zhao; Jeffrey Lam (Microelectron. Reliab., 2018)