Multi-Partner Project: Advancing European Semiconductor and Chiplet Innovation Through the Bavarian Chip Design Center. - Hussam Amrouch; Jehaan Joseph; Michael Schirmer; Johannes Geier; Ulf Schlichtmann; Michael Meidinger; Thomas Wild; Andreas Herkersdorf; Jens Nöpel; Georg Sigl; Yicheng Zhang; Carsten Trinitis; et al. (DATE, 2026)