A novel decapsulation technique for failure analysis of epoxy molded IC packages with Cu wire bonds. - Chien-Pan Liu; Yen-Fu Liu; Chang-Hung Li; Hung-Chieh Cheng; Yi-Chun Kung; Jeng-Yu Lin (Microelectron. Reliab., 2012)

Facile chemical method of etching polyimide films for failure analysis (FA) applications and its etching mechanism studies. - Chien-Pan Liu; Jeng-Yu Lin; Yen-Fu Liu; Shoou-Jinn Chang (Microelectron. Reliab., 2014)