Alloying modification of Sn-Ag-Cu solders by manganese and titanium. - Li-Wei Lin; Jenn-Ming Song; Yi-Shao Lai; Ying-Ta Chiu; Ning-Cheng Lee; Jun-Yen Uan (Microelectron. Reliab., 2009)

Influence of trace alloying elements on the ball impact test reliability of SnAgCu solder joints. - Jenn-Ming Song; Yao-Ren Liu; Yi-Shao Lai; Ying-Ta Chiu; Ning-Cheng Lee (Microelectron. Reliab., 2012)

Guest Editorial - Low Temperature Processing for Microelectronics and Microsystems Packaging. - Tadatomo Suga; Jenn-Ming Song; Yi-Shao Lai (Microelectron. Reliab., 2012)

Power electronics packaging. - Katsuaki Suganuma; Jenn-Ming Song; Yi-Shao Lai (Microelectron. Reliab., 2015)

Surface Modification for Ultrasonic Cu-to-Cu Direct Bonding. - Chih-Hsien Chiu; Wei-Ting Chen; Jenn-Ming Song (3DIC, 2024)