A self-synchronized RF-interconnect for 3-dimensional integrated circuits. - Qun Gu; Zhiwei Xu 003; Jenwei Ko; Szukang Hsien; M. Frank Chang (ISCAS (4), 2004)

Two 10Gb/s/pin Low-Power Interconnect Methods for 3D ICs. - Qun Gu; Zhiwei Xu 003; Jenwei Ko; Mau-Chung Frank Chang (ISSCC, 2007)

2.5 A high-efficiency multiband Class-F power amplifier in 0.153µm bulk CMOS for WCDMA/LTE applications. - Jenwei Ko; Xiaochuan Guo; Changhua Cao; Saravanan Rajapandian; Solti Peng; Jing Li; Wenchang Lee; Narayanan Baskaran; Caiyi Wang (ISSCC, 2017)