Thermal Frequency Reconfigurable Electromagnetic Absorber Using Phase Change Material. - Heijun Jeong; Jeong-Heum Park; You-Hwan Moon; Chang-Wook Baek; Sungjoon Lim (Sensors, 2018)

V-Band End-Fire Radiating Planar Micromachined Helical Antenna Using Through-Glass Silicon Via (TGSV) Technology. - Aqeel Hussain Naqvi; Jeong-Heum Park; Chang-Wook Baek; Sungjoon Lim (IEEE Access, 2019)

Via-Monopole Based Quasi Yagi-Uda Antenna for W-Band Applications using Through Glass Silicon via (TGSV) Technology. - Aqeel Hussain Naqvi; Jeong-Heum Park; Chang-Wook Baek; Sungjoon Lim (IEEE Access, 2020)