High temperature reliability and interfacial reaction of eutectic Sn-0.7Cu/Ni solder joints during isothermal aging. - Jeong-Won Yoon; Seung-Boo Jung (Microelectron. Reliab., 2006)

Au-SN Flip-Chip Solder Bump for Microelectronic and Optoelectronic Applications - Jeong-Won Yoon; Hyun-Suk Chun; Ja-Myeong Koo; Seung-Boo Jung (CoRR, 2007)

Mechanical reliability of Sn-rich Au-Sn/Ni flip chip solder joints fabricated by sequential electroplating method. - Jeong-Won Yoon; Hyun-Suk Chun; Bo-In Noh; Ja-Myeong Koo; Jong-Woong Kim; Hoo-Jeong Lee; Seung-Boo Jung (Microelectron. Reliab., 2008)

Effects of isothermal aging and temperature-humidity treatment of substrate on joint reliability of Sn-3.0Ag-0.5Cu/OSP-finished Cu CSP solder joint. - Jeong-Won Yoon; Bo-In Noh; Young-Ho Lee; Hyo-Soo Lee; Seung-Boo Jung (Microelectron. Reliab., 2008)

Joint reliability evaluation of thermo-compression bonded FPCB/RPCB joints under high temperature storage test. - Jeong-Won Yoon; Min-Kwan Ko; Bo-In Noh; Seung-Boo Jung (Microelectron. Reliab., 2013)

Electrical properties and electrochemical migration characteristics of directly printed Ag patterns with various sintering conditions. - Jeong-Won Yoon; Bo-In Noh; Seung-Boo Jung (Microelectron. Reliab., 2014)

Interfacial reactions and mechanical strength of Sn-3.0Ag-0.5Cu/Ni/Cu and Au-20Sn/Ni/Cu solder joints for power electronics applications. - Byung-Suk Lee; Yong-Ho Ko; Jung-Hwan Bang; Chang-Woo Lee; Sehoon Yoo; Jun-Ki Kim; Jeong-Won Yoon (Microelectron. Reliab., 2017)