A Low Power TSV I/O with Data Rate up to 10 Gb/s for Next Generation HBM. - Ji-Young Kim; Taeryeong Kim; Jeonghyeok You; Ki-Ryong Kim; Byoung-Mo Moon; Kyomin Sohn; Seong-Ook Jung (VLSI Technology and Circuits, 2022)

A Low-Voltage Area-Efficient TSV I/O for HBM with Data Rate up to 15Gb/s Featuring Overlapped Multiplexing Driver, ISI Compensators and QEC. - Taeryeong Kim; Ji-Young Kim; Jeonghyeok You; Hohyun Chae; Byoung-Mo Moon; Kyomin Sohn; Seong-Ook Jung (VLSI Technology and Circuits, 2023)

An Energy-Efficient Design of TSV I/O for HBM With a Data Rate up to 10 Gb/s. - Ji-Young Kim; Taeryeong Kim; Jeonghyeok You; Ki-Ryong Kim; Byoung-Mo Moon; Kyomin Sohn; Seong-Ook Jung (IEEE J. Solid State Circuits, 2023)

Design and Analysis of Static-Free PAM-4 Transmitter for HBM TSV Interface. - Jeonghyeok You; Hohyun Chae; Taeryeong Kim; Ji Hoon Lee; Seong-Ook Jung (ICEIC, 2025)

A Low-Voltage Area-Efficient TSV I/O With QEC Realizing Data Rate up to 15 Gb/s for TSV Interface. - Taeryeong Kim; Ji-Young Kim; Jeonghyeok You; Hohyun Chae; Byoung-Mo Moon; Kyomin Sohn; Seong-Ook Jung (IEEE J. Solid State Circuits, 2025)