Packaging influences on the reliability of MEMS resonators. - Jeroen J. M. Zaal; W. D. van Driel; S. Bendida; Q. Li; J. T. M. van Beek; G. Q. Zhang (Microelectron. Reliab., 2008)

Solder interconnect reliability under drop impact loading conditions using High-speed Cold Bump Pull. - Jeroen J. M. Zaal; Hendrik Pieter Hochstenbach; Willem D. van Driel; G. Q. Zhang (Microelectron. Reliab., 2009)

Designing for reliability using a new Wafer Level Package structure. - Hendrik Pieter Hochstenbach; Willem D. van Driel; Dao-Guo Yang; Jeroen J. M. Zaal; E. Bagerman (Microelectron. Reliab., 2010)

Challenges in the Assembly and Handling of Thin Film Capped MEMS Devices. - Jeroen J. M. Zaal; Willem D. van Driel; G. Q. Zhang (Sensors, 2010)

Moisture absorption by molding compounds under extreme conditions: Impact on accelerated reliability tests. - Amar Mavinkurve; Jaume L. M. Llacer Martinez; Michiel van Soestbergen; Jeroen J. M. Zaal (Microelectron. Reliab., 2016)

AI-Enabled Board Level Vibration Testing: Unveiling The Physics of Degradation. - Varun Thukral; Chen He; Rebecca Chen; Letian Zhang; Romuald Roucou; Michiel van Soestbergen; Jeroen J. M. Zaal; Rene Rongen; Willem D. van Driel; G. Q. Zhang (ITC, 2024)