High-resolution X-ray computed tomography of through silicon vias for RF MEMS integrated passive device applications. - P. J. de Veen; C. Bos; D. R. Hoogstede; C. Th. A. Revenberg; Jessica Liljeholm; Thorbjorn Ebefors (Microelectron. Reliab., 2015)

Challenges for Miniaturised Energy Harvesting Sensor Systems. - Cristina Rusu; Sebastian Bader 002; Bengt Oelmann; Atila Alvandpour; Peter Enoksson; Tanja Braun; S. Tiedke; R. Dal Molin; G. Férin; P. Torvinen; Jessica Liljeholm (ICAIT, 2018)

Through-Glass Vias for Glass Interposers and MEMS Packaging Applications Fabricated Using Magnetic Assembly of Microscale Metal Wires. - Miku J. Laakso; Simon J. Bleiker; Jessica Liljeholm; Gustaf E. Martensson; Mikhail Asiatici; Andreas C. Fischer; Göran Stemme; Thorbjorn Ebefors; Frank Niklaus (IEEE Access, 2018)