Performance Characterization of TSV in 3D IC via Sensitivity Analysis. - Jhih-Wei You; Shi-Yu Huang; Ding-Ming Kwai; Yung-Fa Chou; Cheng-Wen Wu (Asian Test Symposium, 2010)

In-Situ Method for TSV Delay Testing and Characterization Using Input Sensitivity Analysis. - Jhih-Wei You; Shi-Yu Huang; Yu-Hsiang Lin; Meng-Hsiu Tsai; Ding-Ming Kwai; Yung-Fa Chou; Cheng-Wen Wu (IEEE Trans. Very Large Scale Integr. Syst., 2013)