Microstructural evolution of ultrasonically bonded high purity Al wire during extended range thermal cycling. - Pearl A. Agyakwa; Martin R. Corfield; Li Yang; Jianfeng Li 002; V. M. F. Marques; C. Mark Johnson (Microelectron. Reliab., 2011)

Degradation of thermal interface materials for high-temperature power electronics applications. - Robert Skuriat; Jianfeng Li 002; Pearl A. Agyakwa; Nevil Mattey; Paul Evans; C. Mark Johnson (Microelectron. Reliab., 2013)

Dependence of overcurrent failure modes of IGBT modules on interconnect technologies. - Imran Yaqub; Jianfeng Li 002; Christopher Mark Johnson (Microelectron. Reliab., 2015)

A thermal cycling reliability study of ultrasonically bonded copper wires. - Elaheh Arjmand; Pearl A. Agyakwa; Martin R. Corfield; Jianfeng Li 002; Bassem Mouawad; C. Mark Johnson (Microelectron. Reliab., 2016)

Comparison of power cycling reliability of flexible PCB interconnect smaller/thinner and larger/thicker power devices with topside Sn-3.5Ag solder joints. - Jianfeng Li 002; Jingru Dai; Christopher Mark Johnson (Microelectron. Reliab., 2018)