Electrical-thermal co-analysis for power delivery networks in 3D system integration. - Jianyong Xie; Daehyun Chung; Madhavan Swaminathan; Michael McAllister; Alina Deutsch; Lijun Jiang; Barry J. Rubin (3DIC, 2009)

3D transient thermal solver using non-conformal domain decomposition approach. - Jianyong Xie; Madhavan Swaminathan (ICCAD, 2012)

Electrical and thermal analysis for design exchange formats in three dimensional integrated circuits. - Rishik Bazaz; Jianyong Xie; Madhavan Swaminathan (ISQED, 2013)

13.6 A 2.4GHz WLAN digital polar transmitter with synthesized digital-to-time converter in 14nm trigate/FinFET technology for IoT and wearable applications. - Paolo Madoglio; Hongtao Xu; Kailash Chandrashekar; Luis Cuellar 001; Muhammad Faisal; Yee William Li; Hyung Seok Kim; Khoa Minh Nguyen; Yulin Tan; Brent R. Carlton; Vaibhav A. Vaidya; Yanjie Wang; et al. (ISSCC, 2017)

Multiple-Reflection Noise Attenuation Using Adaptive Randomized-Order Empirical Mode Decomposition. - Wei Chen 031; Jianyong Xie; Shaohuan Zu; Shuwei Gan; Yangkang Chen (IEEE Geosci. Remote. Sens. Lett., 2017)

Application of Principal Component Analysis in Weighted Stacking of Seismic Data. - Jianyong Xie; Wei Chen 031; Dong Zhang 005; Shaohuan Zu; Yangkang Chen (IEEE Geosci. Remote. Sens. Lett., 2017)

Spike-Like Blending Noise Attenuation Using Structural Low-Rank Decomposition. - Yatong Zhou; Chaojun Shi; Hanming Chen; Jianyong Xie; Guoning Wu; Yangkang Chen (IEEE Geosci. Remote. Sens. Lett., 2017)

A 0.5pJ/bit 7.2Gbps HBM3 PHY on Intel4 with EMIB Packaging and Unmatched Receiver Architecture on PHY Side with Per Bit Deskew Correction. - Aakash Hasmukhray Mehta; Javed S. Gaggatur; Mohammad M. Rashid; Sampath Dakshinamurthy; Aruna Kumar Lakya Srinivasamurthy; Anil Kumar Goyal; Subbarao Manam; Harshit Gupta; Sandeep Sukumar; Vipin K. Mishra; Koushik N. S; Santosh Nekkanti; et al. (VLSID, 2025)