Thermomechanical property of diffusion barrier layer and its effect on the stress characteristics of copper submicron interconnect structures. - Jie-Hua Zhao; Wen-Jie Qi; Paul S. Ho (Microelectron. Reliab., 2002)

Reliability issues for flip-chip packages. - Paul S. Ho; Guotao Wang; Min Ding 003; Jie-Hua Zhao; Xiang Dai (Microelectron. Reliab., 2004)

A three-parameter Weibull-like fitting function for flip-chip die strength data. - Jie-Hua Zhao (Microelectron. Reliab., 2004)

Dual stage modeling of moisture absorption and desorption in epoxy mold compounds. - Mark D. Placette; Xuejun Fan; Jie-Hua Zhao; Darvin Edwards (Microelectron. Reliab., 2012)