Sparse Reconstruction for Microdefect Detection of Two-Dimensional Ultrasound Image Based on Blind Estimation. - Lei Su 002; Xiaonan Yu; Ke Li 038; Jiefei Gu; Michael G. Pecht (IEEE Trans. Ind. Electron., 2021)

A Novel Three-Probability Spaces Logic Decoupling Distillation for Flip-Chip Defect Detection. - Yu Sun; Lei Su 002; Jiefei Gu; Ke Li 038; Michael G. Pecht (IEEE Trans. Instrum. Meas., 2023)

Flip-chip solder bumps defect detection using a self-search lightweight framework. - Yu Sun; Lei Su 002; Jiefei Gu; Xinwei Zhao; Ke Li 038; Michael G. Pecht (Adv. Eng. Informatics, 2024)

Category-level selective dual-adversarial network using significance-augmented unsupervised domain adaptation for surface defect detection. - Siyu Zhang; Lei Su 002; Jiefei Gu; Ke Li 038; Weitian Wu; Michael G. Pecht (Expert Syst. Appl., 2024)

Search for a Dual-Convergence Sparse Feature Extractor With Visualization Vibration Signals Architecture Feature for Flip-Chip Defect Detection. - Yu Sun; Lei Su 002; Jiefei Gu; Xinwei Zhao; Ke Li 038; Michael G. Pecht (IEEE Trans. Ind. Informatics, 2024)

Semi-supervised dual-constraint centroid contrastive prototypical network for flip chip defect detection under limited labeled data. - Yunxia Lou; Lei Su 002; Jiefei Gu; Xinwei Zhao; Ke Li 038; Michael G. Pecht (Eng. Appl. Artif. Intell., 2025)