Advanced motor driving circuit with improved transfer efficiency based on adaptive segmented control. - Kui Ma; Kaiying Xu; Fashun Yang; Jiexin Lin (IEICE Electron. Express, 2021)

Embedded heat dissipation structure composed of TSVs gradually shrinking from bottom to top in stacked power chips. - Rui Hu; Mengru Huang; Linhong Lu; Fashun Yang; Jiexin Lin; Kui Ma; Zhao Ding (IEICE Electron. Express, 2024)

Novel accurate steady-state thermal resistance model for power chips embedded in TTSVs heat dissipation array. - Linhong Lu; Xinghua Fu; Rui Hu; Fashun Yang; Jiexin Lin; Zhongchen Bai; Kui Ma (Microelectron. J., 2024)

How phonological and orthographic decoding complicates the simple view of reading in Chinese: examining mediation through listening comprehension. - Jiexin Lin; Haomin Zhang (Cogn. Process., 2025)