Fast filling of through-silicon via (TSV) with conductive polymer/metal composites. - Jin Kawakita; Barbara Horváth; Toyohiro Chikyow (3DIC, 2015)

Conductive polymer/metal composite for flexible interconnect. - Jin Kawakita; Toyohiro Chikyow (ICICDT, 2016)

Photoelectroscopic Study of Mn Barrier Layer on SiO2 for Si Wafer Bonding Process. - Takahiro Nagata; Kazumichi Tsumura; Kenro Nakamura; Kengo Uchida; Jin Kawakita; Toyohiro Chikyow; Kazuyuki Higashi (3DIC, 2019)

Enhancement of Sensitivity and Accuracy of Micro/Nano Water Droplets Detection Using Galvanic-Coupled Arrays. - Rekha Goswami Shrestha; Tatsuya Ando; Yukihiro Sakamoto; Jin Kawakita (Sensors, 2019)

Quick and Sensitive Detection of Water Using Galvanic-Coupled Arrays with a Submicron Gap for the Advanced Prediction of Dew Condensation. - Rekha Goswami Shrestha; Yusuke Kubota; Yukihiro Sakamoto; Jin Kawakita (Sensors, 2020)