Influence of underfill materials on the reliability of coreless flip chip package. - Chun-Chih Chuang; Tsung-Fu Yang; Jin-Ye Juang; Yin-Po Hung; Chau-Jie Zhan; Yu-Min Lin; Ching-Tsung Lin; Pei-Chen Chang; Tao-Chih Chang (Microelectron. Reliab., 2008)

Analysis of bump resistance and current distribution of ultra-fine-pitch microbumps. - Y. W. Chang; H. Y. Peng; R. W. Yang; Chih Chen; T. C. Chang; Chau-Jie Zhan; Jin-Ye Juang; Annie T. Huang (Microelectron. Reliab., 2013)