Dynamic responses and solder joint reliability under board level drop test. - Jing-en Luan; Tong Yan Tee; Eric Pek; Chwee Teck Lim; Zhaowei Zhong (Microelectron. Reliab., 2007)

Interface delamination analysis of TQFP package during solder reflow. - Hu Guojun; Roberto Rossi; Jing-en Luan; Xavier Baraton (Microelectron. Reliab., 2010)