Multimaterial and Multilayer Direct Digital Manufacturing of 3-D Structural Microwave Electronics. - Kenneth H. Church; Nathan B. Crane; Paul I. Deffenbaugh; Thomas P. Ketterl; Clayton G. Neff; Patrick B. Nesbitt; Justin T. Nussbaum; Casey Perkowski; Harvey Tsang; Juan Castro; Jing Wang 048; Thomas M. Weller (Proc. IEEE, 2017)

Finite Element Analysis for Surface Acoustic Wave Device Characteristic Properties and Sensitivity. - Tao Wang 038; Ryan Green; Rasim Guldiken; Jing Wang 048; Subhra Mohapatra; Shyam Sundar Mohapatra (Sensors, 2019)

Perturbation Analysis of a Multiple Layer Guided Love Wave Sensor in a Viscoelastic Environment. - Tao Wang 038; Ryan Murphy; Jing Wang 048; Shyam Sundar Mohapatra; Subhra Mohapatra; Rasim Guldiken (Sensors, 2019)

Thin-Piezo on Single-Crystal Silicon Reactive Etched RF MEMS Resonators. - Adnan Zaman; Abdulrahman Alsolami; Ivan F. Rivera; Jing Wang 048 (IEEE Access, 2020)