A Comparative Study on Various Au Wire Rinse Compositions and Their Effects on the Electronic Flame-Off Errors of Wire-Bonding Semiconductor Package. - Jisu Lim; Wonbin Kim; Suk Jekal; Jiwon Kim; Ha-Yeong Kim; Zambaga Otgonbayar; Jeoung Han Kim; Jinsung Rho; Woo-Jin Song; Chang-Min Yoon (IEEE Access, 2025)

Dual Strategy of Electroless Metal Deposition and Surface Silylation Toward Scalable Low-Temperature Hybrid Bonding for Advanced Packaging Applications. - Zambaga Otgonbayar; Jeoung Han Kim; Jinsung Rho; Jeong-Chul Kim; Jungchul Noh; Jeonghun Kim; Seong-Ho Yoon; Chang-Min Yoon (IEEE Access, 2025)