Towards elastic anisotropy and strain-induced void formation in Cu-Sn crystalline phases. - Jiunn Chen; Yi-Shao Lai (Microelectron. Reliab., 2009)

Redistribution in wafer level chip size packaging technology for high power device applications: Process and design considerations. - Jiunn Chen; Yi-Shao Lai; Chueh-An Hsieh; Chia Yi Hu (Microelectron. Reliab., 2010)

Investigation of growth behavior of Al-Cu intermetallic compounds in Cu wire bonding. - Jiunn Chen; Yi-Shao Lai; Yi-Wun Wang; C. Robert Kao (Microelectron. Reliab., 2011)