Relevance of contact reliability in HBM-ESD test equipment. - Joachim C. Reiner; Thomas Keller (Microelectron. Reliab., 2001)

Novel FIB-based sample preparation technique for TEM analysis of ultra-thin gate oxide breakdown. - Joachim C. Reiner; Philippe Gasser; Urs Sennhauser (Microelectron. Reliab., 2002)

Pre-breakdown leakage current fluctuations of thin gate oxide. - Joachim C. Reiner (Microelectron. Reliab., 2003)

Electrostatic Effects on Semiconductor Tools. - Peter Jacob; Joachim C. Reiner (Microelectron. Reliab., 2004)

Gallium Artefacts on FIB-milled Silicon Samples. - Joachim C. Reiner; Philipp Nellen; Urs Sennhauser (Microelectron. Reliab., 2004)

Electrostatic discharge directly to the chip surface, caused by automatic post-wafer processing. - Peter Jacob; Uwe Thiemann; Joachim C. Reiner (Microelectron. Reliab., 2005)