Simultaneous power and thermal integrity driven via stapling in 3D ICs. - Hao Yu 001; Joanna Ho; Lei He 001 (ICCAD, 2006)

Allocating power ground vias in 3D ICs for simultaneous power and thermal integrity. - Hao Yu 001; Joanna Ho; Lei He 001 (ACM Trans. Design Autom. Electr. Syst., 2009)

Seeking Value Through Deviation? Economic Impacts of IT Overinvestment and Underinvestment. - Joanna Ho; Feng Tian 011; Anne Wu; Sean Xin Xu (Inf. Syst. Res., 2017)