Test methodology for durability estimation of surface mount interconnects under drop testing conditions. - Joe Varghese; Abhijit Dasgupta 002 (Microelectron. Reliab., 2007)

An experimental approach to characterize rate-dependent failure envelopes and failure site transitions in surface mount assemblies. - Joe Varghese; Abhijit Dasgupta 002 (Microelectron. Reliab., 2007)

Effect of geometric complexities and nonlinear material properties on interfacial crack behavior in electronic devices. - Koustav Sinha; Joe Varghese; Abhijit Dasgupta 002 (Microelectron. Reliab., 2014)