Experimental characterization of the mechanical behavior of two solder alloys for high temperature power electronics applications. - Sabeur Msolli; Joël Alexis; Olivier Dalverny; Moussa Karama (Microelectron. Reliab., 2015)

Microstructural evolutions of Sn-3.0Ag-0.5Cu solder joints during thermal cycling. - J. B. Libot; Joël Alexis; Olivier Dalverny; L. Arnaud; P. Milesi; F. Dulondel (Microelectron. Reliab., 2018)