Foldable Flex and Thinned Silicon Chips for Multichip Packaging; John Balde (Ed.), Kluwer Academic Publishers, Boston, USA, December 2002. Hardbound, 340 pp, Number of figures and tables 200, ISBN 0-7923-7676-5. - Johan Liu (Microelectron. Reliab., 2003)

System-on-package: a broad perspective from system design to technology development. - Li-Rong Zheng 001; Johan Liu (Microelectron. Reliab., 2003)

Study on thermomechanical reliability of a tunable light modulator. - Zhimin Mo; Helge Kristiansen; Morten Eliassen; Shiming Li; Johan Liu (Microelectron. Reliab., 2004)

Effect of different temperature cycling profiles on the crack initiation and propagation of Sn-3.5Ag wave soldered solder joints. - C. Andersson; D. R. Andersson; Per-Erik Tegehall; Johan Liu (Microelectron. Reliab., 2007)

Mechanical and thermal characterization of a novel nanocomposite thermal interface material for electronic packaging. - Shuangxi Sun; Si Chen; Xin Luo; Yifeng Fu; Lilei Ye; Johan Liu (Microelectron. Reliab., 2016)

Interface and interconnection stresses in electronic assemblies - A critical review of analytical solutions. - Ee-Hua Wong; Johan Liu (Microelectron. Reliab., 2017)