Determination of migration effects in Cu-via structures with respect to process-induced stress. - Kirsten Weide-Zaage; Jiani Zhao; Joharsyah Ciptokusumo; Oliver Aubel (Microelectron. Reliab., 2008)

Investigation of stress distribution in via bottom of Cu-via structures with different via form by means of submodeling. - Joharsyah Ciptokusumo; Kirsten Weide-Zaage; Oliver Aubel (Microelectron. Reliab., 2009)