Packaging the IBM eServer z990 central electronic complex. - Juan C. Parrilla; Frank E. Bosco; John S. Corbin; John J. Loparco; Prabjit Singh; John G. Torok (IBM J. Res. Dev., 2004)

Packaging design of the IBM System z10 Enterprise Class platform central electronic complex. - John G. Torok; Frank E. Bosco; W. L. Brodsky; E. F. Furey; Gary F. Goth; Daniel J. Kearney; John J. Loparco; M. T. Peets; K. L. Pizzolato; Donald W. Porter; G. Ruehle; W. H. White (IBM J. Res. Dev., 2009)

Mechanical packaging, power, and cooling design for the IBM z13. - John G. Torok; Frank E. Bosco; Gary F. Goth; John J. Loparco; M. T. Peets; Donald W. Porter; S. G. Shevach; B. C. Tucker; A. C. VanDeventer; X. Wei; P. A. Wendling; Y. Yu; et al. (IBM J. Res. Dev., 2015)

IBM z14: Improved datacenter characteristics, energy efficiency, and packaging innovation. - William P. Kostenko; Dustin W. Demetriou; John G. Torok (IBM J. Res. Dev., 2018)

IBM z15: Improved data center density and energy efficiency, new system packaging, and modeling. - William P. Kostenko; John G. Torok; Dustin W. Demetriou (IBM J. Res. Dev., 2020)

A Cross-Functional Approach to Metal Additive Manufacturing in Enterprise. - Khaalid McMillan; Mehdi Hamid; John G. Torok; Kyle Olson; James Utter; Anthony Tiano (TE, 2022)