Investigation of long-term reliability and failure mechanism of solder interconnections with multifunctional micro-moiré interferometry system. - X. Q. Shi; John H. L. Pang; X. R. Zhang (Microelectron. Reliab., 2004)

Drop impact reliability testing for lead-free and lead-based soldered IC packages. - Desmond Y. R. Chong; F. X. Che; John H. L. Pang; Kellin Ng; Jane Y. N. Tan; Patrick T. H. Low (Microelectron. Reliab., 2006)

Modeling and simulation for a drop-impact analysis of multi-layered printed circuit boards. - Yuqi Wang; K. H. Low; John H. L. Pang; Kay Hiang Hoon; F. X. Che; Y. S. Yong (Microelectron. Reliab., 2006)

Digital image correlation for solder joint fatigue reliability in microelectronics packages. - Yaofeng Sun; John H. L. Pang (Microelectron. Reliab., 2008)

The influence of solder volume and pad area on Sn-3.8Ag-0.7Cu and Ni UBM reaction in reflow soldering and isothermal aging. - C. K. Wong; John H. L. Pang; J. W. Tew; B. K. Lok; H. J. Lu; F. L. Ng; Y. F. Sun (Microelectron. Reliab., 2008)

Vibration reliability test and finite element analysis for flip chip solder joints. - F. X. Che; John H. L. Pang (Microelectron. Reliab., 2009)

Study on reliability of PQFP assembly with lead free solder joints under random vibration test. - F. X. Che; John H. L. Pang (Microelectron. Reliab., 2015)

A YOLOv3-based Deep Learning Application Research for Condition Monitoring of Rail Thermite Welded Joints. - Yang Liu 220; Xin Sun 015; John Hock Lye Pang (IVSP, 2020)