Design and analysis of bi-directional pumping silicon Raman laser. - Ying Huang; Ming Tang 005; Ping Shum 001; Jing Zhang; John H. Lau (ICAIT, 2008)

Design, assembly and reliability of large die and fine-pitch Cu/low-k flip chip package. - Yue Ying Ong; Soon Wee Ho; Kripesh Vaidyanathan; Vasarla Nagendra Sekhar; Ming Chinq Jong; Samuel Lim Yak Long; Vincent Lee Wen Sheng; Leong Ching Wai; Vempati Srinivasa Rao; Jimmy Ong; Xuefen Ong; Xiaowu Zhang; et al. (Microelectron. Reliab., 2010)

Recent advances and new trends in nanotechnology and 3D integration for semiconductor industry. - John H. Lau (3DIC, 2011)

Effects of TSVs (through-silicon vias) on thermal performances of 3D IC integration system-in-package (SiP). - John H. Lau; Tang Gong Yue (Microelectron. Reliab., 2012)

Challenges of Cu CMP of TSVs and RDLs fabricated from the backside of a thin wafer. - Jui-Chin Chen; John H. Lau; Tzu-Chien Hsu; Chien-Chou Chen; Pei-Jer Tzeng; Po-Chih Chang; Chun-Hsien Chien; Yiu-Hsiang Chang; Shang-Chun Chen; Yu-Chen Hsin; Sue-Chen Liao; Cha-Hsin Lin; et al. (3DIC, 2013)