John J. H. Reche

According to our database1, John J. H. Reche
  • authored at least 1 paper in 2003.
  • has a "Dijkstra number"2 of six.

Timeline

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Article 
PhD thesis 
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Links

On csauthors.net:

Bibliography

2003
Wafer level packaging having bump-on-polymer structure.
Microelectronics Reliability, 2003


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