Feature-scale simulation of resist-patterned electrodeposition. - John O. Dukovic (IBM J. Res. Dev., 1993)

Damascene copper electroplating for chip interconnections. - Panayotis C. Andricacos; Cyprian Uzoh; John O. Dukovic; Jean Horkans; Hariklia Deligianni (IBM J. Res. Dev., 1998)