Measuring stress next to Au ball bond during high temperature aging. - M. Mayer; J. T. Moon; John Persic (Microelectron. Reliab., 2009)

Influence of gold pick up on the hardness of copper free air ball. - Jae-sik Lee; Michael Mayer; Norman Y. Zhou; J. T. Moon; John Persic (Microelectron. Reliab., 2011)

Effect of gas type and flow rate on Cu free air ball formation in thermosonic wire bonding. - A. Pequegnat; H. J. Kim; M. Mayer; Norman Y. Zhou; John Persic; J. T. Moon (Microelectron. Reliab., 2011)

Reduction of ultrasonic pad stress and aluminum splash in copper ball bonding. - Aashish Shah; Alireza Rezvani; M. Mayer; Norman Y. Zhou; John Persic; J. T. Moon (Microelectron. Reliab., 2011)