Die to wafer 3D stacking for below 10um pitch microbumps. - Jaber Derakhshandeh; Lin Hou; Inge De Preter; Carine Gerets; Samuel Suhard; Vikas Dubey; Geraldine Jamieson; Fumihiro Inoue; Tomas Webers; Pieter Bex; Giovanni Capuz; Eric Beyne; et al. (3DIC, 2016)

(Why do we need) Wireless Heterogeneous Integration (anyway?). - Michaël Peeters; S. Sinha; Xiao Sun; Claude Desset; Giuseppe Gramegna; John Slabbekoorn; Pieter Bex; Nelson Pinho; Tomas Webers; Dimitrios Velenis; Andy Miller; Nadine Collaert; et al. (VLSI Technology and Circuits, 2022)

Clean Dicing: An Alternative Blade Dicing Technique for Minimising Particles in 3D Heterogeneous Integration. - Akito Hiro; Damien Jon Leech; Geert Schoofs; John Slabbekoorn; Alain Phommahaxay; Koen Kennes; Gerald Beyer; Eric Beyne (3DIC, 2024)