IBM System/390 air-cooled alumina thermal conduction module. - John U. Knickerbocker; George B. Leung; William R. Miller; Steven P. Young; Scott A. Sands; Richard F. Indyk (IBM J. Res. Dev., 1991)

High-performance glass-ceramic/copper multilayer substrate with thin-film redistribution. - Rao R. Tummala; John U. Knickerbocker; Sarah H. Knickerbocker; L. Wynn Herron; Robert W. Nufer; Raj N. Master; Mark O. Neisser; Benedikt M. Kellner; Charles H. Perry; James N. Humenik; Thomas F. Redmond (IBM J. Res. Dev., 1992)

An advanced multichip module (MCM) for high-performance UNIX servers. - John U. Knickerbocker; Frank L. Pompeo; Alice F. Tai; Donald L. Thomas; Roger D. Weekly; Michael G. Nealon; Harvey C. Hamel; Anand Haridass; James N. Humenik; Richard A. Shelleman; Srinivasa N. Reddy; Kevin M. Prettyman; et al. (IBM J. Res. Dev., 2002)

Three dimensional silicon integration using fine pitch interconnection, silicon processing and silicon carrier packaging technology. - John U. Knickerbocker; Chirag S. Patel; Paul S. Andry; Cornelia K. Tsang; L. Paivikki Buchwalter; Edmund J. Sprogis; Hua Gan; Raymond R. Horton; Robert J. Polastre; Steven L. Wright; Christian D. Schuster; Christian W. Baks; et al. (CICC, 2005)

Development of next-generation system-on-package (SOP) technology based on silicon carriers with fine-pitch chip interconnection. - John U. Knickerbocker; Paul S. Andry; L. Paivikki Buchwalter; Alina Deutsch; Raymond R. Horton; Keith A. Jenkins; Young Hoon Kwark; Gerald McVicker; Chirag S. Patel; Robert J. Polastre; Christian D. Schuster; Arun Sharma; et al. (IBM J. Res. Dev., 2005)

3-D Silicon Integration and Silicon Packaging Technology Using Silicon Through-Vias. - John U. Knickerbocker; Chirag S. Patel; Paul S. Andry; Cornelia K. Tsang; L. Paivikki Buchwalter; Edmund J. Sprogis; Hua Gan; Raymond R. Horton; Robert J. Polastre; Steven L. Wright; John M. Cotte (IEEE J. Solid State Circuits, 2006)

3D chip stacking with C4 technology. - Bing Dang; Steven L. Wright; Paul S. Andry; Edmund J. Sprogis; Cornelia K. Tsang; M. John Interrante; Bucknell C. Webb; Robert J. Polastre; Raymond R. Horton; Chirag S. Patel; Arun Sharma; J. Zheng; et al. (IBM J. Res. Dev., 2008)

Preface. - John U. Knickerbocker (IBM J. Res. Dev., 2008)

Three-dimensional silicon integration. - John U. Knickerbocker; Paul S. Andry; Bing Dang; Raymond R. Horton; Mario J. Interrante; Chirag S. Patel; Robert J. Polastre; Katsuyuki Sakuma; Ranjani Sirdeshmukh; Edmund J. Sprogis; Sri M. Sri-Jayantha; Antonio M. Stephens; et al. (IBM J. Res. Dev., 2008)

3D chip-stacking technology with through-silicon vias and low-volume lead-free interconnections. - Katsuyuki Sakuma; Paul S. Andry; Cornelia K. Tsang; Steven L. Wright; Bing Dang; Chirag S. Patel; Bucknell C. Webb; J. Maria; Edmund J. Sprogis; S. K. Kang; Robert J. Polastre; Raymond R. Horton; et al. (IBM J. Res. Dev., 2008)

Thermomechanical modeling of 3D electronic packages. - Sri M. Sri-Jayantha; Gerald McVicker; Kerry Bernstein; John U. Knickerbocker (IBM J. Res. Dev., 2008)

Technologies for exascale systems. - Paul W. Coteus; John U. Knickerbocker; Chung H. Lam; Yurii A. Vlasov (IBM J. Res. Dev., 2011)

An 8x 10-Gb/s Source-Synchronous I/O System Based on High-Density Silicon Carrier Interconnects. - Timothy O. Dickson; Yong Liu 023; Sergey V. Rylov; Bing Dang; Cornelia K. Tsang; Paul S. Andry; John F. Bulzacchelli; Herschel A. Ainspan; Xiaoxiong Gu; Lavanya Turlapati; Michael P. Beakes; Benjamin D. Parker; et al. (IEEE J. Solid State Circuits, 2012)

Turning the Finger into a Writing Tool. - Katsuyuki Sakuma; Gaddi Blumrosen; John Jeremy Rice; Jeff Rogers; John U. Knickerbocker (EMBC, 2019)

Back to Finger-Writing: Fingertip Writing Technology Based on Pressure Sensing. - Gaddi Blumrosen; Katsuyuki Sakuma; John Jeremy Rice; John U. Knickerbocker (IEEE Access, 2020)