Diffusion growth of Cu3Sn phase in the bump and thin film Cu/Sn structures. - Biljana Dimcic; Riet Labie; Joke De Messemaeker; Kris Vanstreels; Kris Croes; Bert Verlinden; Ingrid De Wolf (Microelectron. Reliab., 2012)

Sn whisker evaluations in 3D microbumped structures. - George Vakanas; Björn Vandecasteele; David Schaubroeck; Joke De Messemaeker; Geert Willems; Mark Ashworth; Geoffrey D. Wilcox; Ingrid De Wolf (Microelectron. Reliab., 2014)

Impact of oxide liner properties on TSV Cu pumping and TSV stress. - Joke De Messemaeker; O. Varela Pedreira; A. Moussa; Nabi Nabiollahi; Kris Vanstreels; Stefaan Van Huylenbroeck; Harold Philipsen; Patrick Verdonck; Bart Vandevelde; Ingrid De Wolf; Eric Beyne; Kris Croes (IRPS, 2015)

Microstructure simulation of grain growth in Cu through silicon vias using phase-field modeling. - Nabi Nabiollahi; Nele Moelans; Mario Gonzalez; Joke De Messemaeker; Christopher J. Wilson; Kristof Croes; Eric Beyne; Ingrid De Wolf (Microelectron. Reliab., 2015)

Reliability Challenges Related to TSV Integration and 3-D Stacking. - Kristof Croes; Joke De Messemaeker; Yunlong Li; Wei Guo; Olalla Varela Pedreira; Vladimir Cherman; Michele Stucchi; Ingrid De Wolf; Eric Beyne (IEEE Des. Test, 2016)

Impact of via density and passivation thickness on the mechanical integrity of advanced Back-End-Of-Line interconnects. - Luka Kljucar; Mario Gonzalez; Kristof Croes; Ingrid De Wolf; Joke De Messemaeker; Gayle Murdoch; Philip Nolmans; Joeri De Vos; Jürgen Bömmels; Eric Beyne; Zsolt Tökei (Microelectron. Reliab., 2017)