Reduction of defects in TSV filled with Cu by high-speed 3-step PPR for 3D Si chip stacking. - Sung Chul Hong; Wang Gu Lee; Won Joong Kim; Jong Hyeong Kim; Jae Pil Jung (Microelectron. Reliab., 2011)

Operability diagram of drop formation and its response to temperature variation in a piezoelectric inkjet nozzle. - Pyungho Shin; Sukjong Lee; Jaeyong Sung; Jong Hyeong Kim (Microelectron. Reliab., 2011)