Evaluation of displacement rate effect in shear test of Sn-3Ag-0.5Cu solder bump for flip chip application. - Jong-Woong Kim; Dae-Gon Kim; Seung-Boo Jung (Microelectron. Reliab., 2006)

Effect of high-speed loading conditions on the fracture mode of the BGA solder joint. - Jong-Woong Kim; Jin-Kyu Jang; Sang-Ok Ha; Sang-Su Ha; Dae-Gon Kim; Seung-Boo Jung (Microelectron. Reliab., 2008)

Mechanical reliability of Sn-rich Au-Sn/Ni flip chip solder joints fabricated by sequential electroplating method. - Jeong-Won Yoon; Hyun-Suk Chun; Bo-In Noh; Ja-Myeong Koo; Jong-Woong Kim; Hoo-Jeong Lee; Seung-Boo Jung (Microelectron. Reliab., 2008)

Improving the Performance of RTOS using Multiple Register Files Architecture. - Jong-Woong Kim; Soo-Hyun Kwon; Kab-Su Han; Jeong-Hoon Cho (PECCS, 2011)

Improved Speech-Presence Uncertainty Estimation Based on Spectral Gradient for Global Soft Decision-Based Speech Enhancement. - Jong-Woong Kim; Joon-Hyuk Chang; Sang Won Nam; Dong Kook Kim; Jong Won Shin (IEICE Trans. Fundam. Electron. Commun. Comput. Sci., 2013)