Fault isolation of short defect in through silicon via (TSV) based 3D-IC. - Daniel H. Jung; Jonghyun Cho; Heegon Kim; Jonghoon J. Kim; Hongseok Kim; Joungho Kim; Hyun-Cheol Bae; Kwang-Seong Choi (3DIC, 2013)

Eye-diagram simulation and analysis of a high-speed TSV-based channel. - Heegon Kim; Jonghyun Cho; Jonghoon J. Kim; Daniel H. Jung; Sumin Choi; Joungho Kim; Junho Lee; Kunwoo Park (3DIC, 2013)

Non-contact wafer-level TSV connectivity test methodology using magnetic coupling. - Jonghoon J. Kim; Heegon Kim; Sukjin Kim; Bumhee Bae; Daniel H. Jung; Sunkyu Kong; Joungho Kim; Junho Lee; Kunwoo Park (3DIC, 2013)

Magnetic field coupling on analog-to-digital converter from wireless power transfer system in automotive environment. - Bumhee Bae; Sunkyu Kong; Jonghoon J. Kim; Sukjin Kim; Joungho Kim (EMC Compo, 2013)

Modeling and analysis of open defect in through silicon via (TSV) channel. - Daniel H. Jung; Heegon Kim; Jonghoon J. Kim; Joungho Kim; Hyun-Cheol Bae; Kwang-Seong Choi (EMC Compo, 2013)

Design and measurement of a compact on-interposer passive equalizer for chip-to-chip high-speed differential signaling. - Heegon Kim; Jonghyun Cho; Daniel H. Jung; Jonghoon J. Kim; Sumin Choi; Joungho Kim; Junho Lee; Kunwoo Park (EMC Compo, 2013)

Design of contactless wafer-level TSV connectivity testing structure using capacitive coupling. - Jonghoon J. Kim; Heegon Kim; Sukjin Kim; Bumhee Bae; Daniel H. Jung; Sunkyu Kong; Joungho Kim; Junho Lee; Kunwoo Park (EMC Compo, 2013)

Coil Design and Shielding Methods for a Magnetic Resonant Wireless Power Transfer System. - Jiseong Kim; Jonghoon J. Kim; Sunkyu Kong; Hongseok Kim; In-Soo Suh; Nam Pyo Suh; Dong-Ho Cho; Joungho Kim; Seungyoung Ahn (Proc. IEEE, 2013)

Fault detection and isolation of multiple defects in through silicon via (TSV) channel. - Daniel H. Jung; Heegon Kim; Jonghoon J. Kim; Sukjin Kim; Joungho Kim; Hyun-Cheol Bae; Kwang-Seong Choi (3DIC, 2014)

Magnetically-coupled current probing structure consisting of TSVs and RDLs in 2.5D and 3D ICs. - Jonghoon J. Kim; Bumhee Bae; Sukjin Kim; Sunkyu Kong; Heegon Kim; Daniel H. Jung; Joungho Kim (3DIC, 2014)

Electromagnetic Compatibility of Resonance Coupling Wireless Power Transfer in On-Line Electric Vehicle System. - Yangbae Chun; Seongwook Park; Jonghoon J. Kim; Jiseong Kim; Hongseok Kim; Joungho Kim; Nam Kim; Seungyoung Ahn (IEICE Trans. Commun., 2014)

Crosstalk-included eye-diagram estimation for high-speed silicon, organic, and glass interposer channels on 2.5D/3D IC. - Sumin Choi; Heegon Kim; Daniel H. Jung; Jonghoon J. Kim; Jaemin Lim; Hyunsuk Lee; Kyungjun Cho; Joungho Kim; Hyungsoo Kim; Yong-Ju Kim; Yunsaing Kim (3DIC, 2015)

Modeling and analysis of defects in through silicon via channel for non-invasive fault isolation. - Daniel H. Jung; Heegon Kim; Jonghoon J. Kim; Sukjin Kim; Joungho Kim; Hyun-Cheol Bae; Kwang-Seong Choi (3DIC, 2015)

TSV-based current probing structure using magnetic coupling in 2.5D and 3D IC. - Jonghoon J. Kim; Daniel H. Jung; Heegon Kim; Sunkyu Kong; Sumin Choi; Jaemin Lim; Joungho Kim (EMC Compo, 2015)

Shielding structures for through silicon via (TSV) to active circuit noise coupling in 3D IC. - Jaemin Lim; Manho Lee; Daniel H. Jung; Jonghoon J. Kim; Sumin Choi; Hyunsuk Lee; Joungho Kim (EMC Compo, 2015)

Industry's First 7.2 Gbps 512GB DDR5 Module. - Sung Joo Park; Jonghoon J. Kim; Kun Joo; Young-Ho Lee; Kyoungsun Kim; Young-Tae Kim; Woo-Jin Na; IkJoon Choi; Hye-Seung Yu; Wonyoung Kim; Ju-Yeon Jung; Jaejun Lee; et al. (HCS, 2021)