Full-chip TSV-to-TSV coupling analysis and optimization in 3D IC. - Chang Liu 034; Taigon Song; Jonghyun Cho; Joohee Kim; Joungho Kim; Sung Kyu Lim (DAC, 2011)

Analysis of TSV-to-TSV coupling with high-impedance termination in 3D ICs. - Taigon Song; Chang Liu 034; Dae Hyun Kim 004; Sung Kyu Lim; Jonghyun Cho; Joohee Kim; Junso Pak; Seungyoung Ahn; Joungho Kim; Kihyun Yoon (ISQED, 2011)

Analysis of glass interposer PDN and proposal of PDN resonance suppression methods. - Jonghyun Cho; Youngwoo Kim; Joungho Kim; Venky Sundaram; Rao R. Tummala (3DIC, 2013)

Fault isolation of short defect in through silicon via (TSV) based 3D-IC. - Daniel H. Jung; Jonghyun Cho; Heegon Kim; Jonghoon J. Kim; Hongseok Kim; Joungho Kim; Hyun-Cheol Bae; Kwang-Seong Choi (3DIC, 2013)

Eye-diagram simulation and analysis of a high-speed TSV-based channel. - Heegon Kim; Jonghyun Cho; Jonghoon J. Kim; Daniel H. Jung; Sumin Choi; Joungho Kim; Junho Lee; Kunwoo Park (3DIC, 2013)

Design and measurement of a compact on-interposer passive equalizer for chip-to-chip high-speed differential signaling. - Heegon Kim; Jonghyun Cho; Daniel H. Jung; Jonghoon J. Kim; Sumin Choi; Joungho Kim; Junho Lee; Kunwoo Park (EMC Compo, 2013)

Signal integrity design of TSV and interposer in 3D-IC. - Jonghyun Cho; Joungho Kim (LASCAS, 2013)

Analysis and optimization of a power distribution network in 2.5D IC with glass interposer. - Youngwoo Kim; Jonghyun Cho; Kiyeong Kim; Heegon Kim; Joungho Kim; Srikrishna Sitaraman; Venky Sundaram; Rao R. Tummala (3DIC, 2014)

Noise coupling modeling and analysis of through glass via(TGV). - Insu Hwang; Jihye Kim; Youngwoo Kim; Jonghyun Cho; Joungho Kim (3DIC, 2015)

High-Frequency Temperature-Dependent Through-Silicon-Via (TSV) Model and High-Speed Channel Performance for 3-D ICs. - Manho Lee; Daniel H. Jung; Heegon Kim; Jonghyun Cho; Joungho Kim (IEEE Des. Test, 2016)

Suppression of Parallel Plate Modes Using Edge-Located EBG Structure in High-Speed Power Bus. - Jonghyun Cho; Myunghoi Kim (J. Inform. and Commun. Convergence Engineering, 2016)

Electromagnetic Interference Analysis of an Inhomogeneous Electromagnetic Bandgap Power Bus for High-Speed Circuits. - Jonghyun Cho; Myunghoi Kim (J. Inform. and Commun. Convergence Engineering, 2017)

TEM-Like Launch Geometries and Simplified De-embedding for Accurate Through Silicon Via Characterization. - Francesco de Paulis; Stefano Piersanti; Qian Wang; Jonghyun Cho; Nicholas Erickson; Brice Achkir; Jun Fan 001; James L. Drewniak; Antonio Orlandi (IEEE Trans. Instrum. Meas., 2017)