5.6 A 1/2.65in 44Mpixel CMOS Image Sensor with 0.7µm Pixels Fabricated in Advanced Full-Depth Deep-Trench Isolation Technology. - Hyunchul Kim; Jongeun Park; Insung Joe; Doowon Kwon; Joo Hyoung Kim; Dongsuk Cho; Taehun Lee; Changkyu Lee; Haeyong Park; Soojin Hong; Chongkwang Chang; Jingyun Kim; et al. (ISSCC, 2020)

Wafer Level Pixelation of Colloidal Quantum Dot Image Sensors. - Yunlong Li; Gauri Karve; Pawel E. Malinowski; Joo Hyoung Kim; Epimitheas Georgitzikis; Vladimir Pejovic; Myung-Jin Lim; Luis Moreno Hagelsieb; Renaud Puybaret; Itai Lieberman; Jiwon Lee; David Cheyns; et al. (VLSI Technology and Circuits, 2022)

A Thin-Film Pinned-Photodiode Imager Pixel with Fully Monolithic Fabrication and beyond 1Me- Full Well Capacity. - Joo Hyoung Kim; François Berghmans; Abu Bakar Siddik; Irem Sutcu; Isabel Pintor Monroy; Jehyeok Yu; Tristan Weydts; Epimitheas Georgitzikis; Jubin Kang; Yannick Baines; Yannick Hermans; Naresh Chandrasekaran; et al. (Sensors, 2023)